Collet for die bonding

Metal fusion bonding – Process – Plural joints

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Details

228 447, 228 62, 279 3, B23K 3102

Patent

active

045895864

ABSTRACT:
A collet is described for use in die bonding of semiconductor dies which is comprised of a shank portion and a die holder portion which has triangular side walls and is open ended.

REFERENCES:
patent: 3451607 (1969-06-01), Miller et al.
patent: 3676911 (1972-07-01), Austin
patent: 3695501 (1972-10-01), Radobenko
patent: 3698618 (1972-10-01), Helda
patent: 3921884 (1975-11-01), McDonough et al.
Kulicke and Soffa Industries, "Bonding Tools and Production Accessories".

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