Collars, support structures, and forms for protruding...

Details Collars, support structures, and forms for protruding... Collars, support structures, and forms for protruding...

2006-08-22

2006-08-22

Geyer, Scott B. (Department: 2812)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S737000

Reexamination Certificate

active

07095106

ABSTRACT:
Collars, support structures, or forms for protruding conductive structures include apertures or receptacles through which the conductive structure may extend. The aperture or receptacle may be configured to contact a surface of the conductive structure, and even to define a shape of at least a portion of the conductive structure. Each collar, support structure, or form may include a plurality of adjacent, mutually adhered regions.

REFERENCES:
patent: 5173220 (1992-12-01), Reiff et al.
patent: 5264061 (1993-11-01), Juskey et al.
patent: 5278442 (1994-01-01), Prinz et al.
patent: 5281684 (1994-01-01), Moore et al.
patent: 5484314 (1996-01-01), Farnworth
patent: 5545367 (1996-08-01), Bae et al.
patent: 5608260 (1997-03-01), Carper et al.
patent: 5641113 (1997-06-01), Somaki et al.
patent: 5705117 (1998-01-01), O'Connor et al.
patent: 5834366 (1998-11-01), Akram
patent: 5915170 (1999-06-01), Raab et al.
patent: 5924003 (1999-07-01), Slocum
patent: 5934545 (1999-08-01), Gordon
patent: 5977632 (1999-11-01), Beddingfield
patent: 6013571 (2000-01-01), Morrell
patent: 6110760 (2000-08-01), Medlen et al.
patent: 6118179 (2000-09-01), Farnworth et al.
patent: 6143639 (2000-11-01), Medlen et al.
patent: 6180504 (2001-01-01), Farnworth et al.
patent: 6191489 (2001-02-01), Igel et al.
patent: 6251488 (2001-06-01), Miller et al.
patent: 6259962 (2001-07-01), Gothait
patent: 6268584 (2001-07-01), Keicher et al.
patent: 6274473 (2001-08-01), Blish et al.
patent: 6274474 (2001-08-01), Caletka et al.
patent: 6297141 (2001-10-01), Miyazaki
patent: 6297560 (2001-10-01), Capote et al.
patent: 6297562 (2001-10-01), Tilly
patent: 6326698 (2001-12-01), Akram
patent: 6333104 (2001-12-01), Perry et al.
patent: 6344695 (2002-02-01), Murayama
patent: 6352881 (2002-03-01), Nguyen et al.
patent: 6391251 (2002-05-01), Keicher et al.
patent: 6461881 (2002-10-01), Farnworth et al.
patent: 6476502 (2002-11-01), Yamada et al.
patent: 6506671 (2003-01-01), Grigg
patent: 6524346 (2003-02-01), Farnworth
patent: 6544821 (2003-04-01), Akram
patent: 6548897 (2003-04-01), Grigg
patent: 6583354 (2003-06-01), Alcoe
patent: 6630365 (2003-10-01), Farnworth et al.
patent: 6649444 (2003-11-01), Farnworth et al.
patent: 6773957 (2004-08-01), Farnworth et al.
patent: 6861763 (2005-03-01), Akram
patent: 6882049 (2005-04-01), Grigg
patent: 6893904 (2005-05-01), Akram
patent: 6911735 (2005-06-01), Akram et al.
patent: 2002/0043711 (2002-04-01), Akram et al.
patent: 2002/0171177 (2002-11-01), Kritchman et al.
patent: 2003/0043360 (2003-03-01), Farnworth
patent: 2003/0102566 (2003-06-01), Farnworth
patent: 2003/0139030 (2003-07-01), Grigg
patent: 2003/0151167 (2003-08-01), Kritchman et al.
patent: 2003/0170921 (2003-09-01), Akram
patent: 2003/0176016 (2003-09-01), Grigg
patent: 2003/0207213 (2003-11-01), Farnwoth
patent: 2004/0014255 (2004-01-01), Grigg et al.
patent: 2004/0080027 (2004-04-01), Grigg et al.
patent: 2004/0142058 (2004-07-01), Farnworth
Miller et al., “Maskless Mesoscale Materials Deposition”, Deposition Technology, Sep. 2001, pp. 20-22.
Miller, “New Laser-Directed Deposition Technology”, Microelectronic Fabrication, Aug. 2001, p. 16.
Webpage, Objet Prototyping the Future, Objet FullCure700 Series, 1 page.
Webpage, Objet Prototyping the Future, Objet How it Works, 2 pages.
U.S. Appl. No. 09/590,527, filed Jun. 8, 2000, entitled “Structures for Stabilizing Semiconductor Devices Relative to Test Substrates and Methods for Fabricating the Stabilizers”, inventor Salman Akram.
U.S. Appl. No. 09/590,621, filed Jun. 8, 2000, entitled “Stereolithographic Method and Apparatus for Fabricating Stabilizers for Flip-Chip Type Semiconductor Devices and Resulting Structures”, inventor Akram et al.
U.S. Appl. No. 09/590,646, filed Jun. 8, 2000, entitled “Reinforced, Self-Aligning Conductive Structures for Semiconductor Device Components and Methods for Fabricating Same”, inventor Williams et al.

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