Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1994-04-14
1996-09-03
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361704, 174 163, 16510433, H05K 720, G06F 120
Patent
active
055529607
ABSTRACT:
A collapsible heat sink for cooling heat generated by components in a computer system. The heat sink is positioned in an open space formed between a base casing and a bottom cover of the computer system. The heat sink comprises folding fins and cold plates made of conductive surfaces. When the heat sink is in an open position, the folding fins are in an extended position. In the open position, the heat sink exposes the conductive surfaces including the cold plates and the folding fins in the extended position, thereby dissipating the heat generated by the components of the computer system. In a collapsed position of the heat sink, the folding fins are folded. In the collapsed position, the heat sink fits in a minimal space formed between the bottom cover and the base casing of the computer system. As a result, the heat sink consumes minimal additional space.
REFERENCES:
patent: 4092697 (1978-05-01), Spaight
patent: 4326215 (1982-04-01), Suzuki et al.
patent: 4360141 (1982-11-01), Kensrue
patent: 4415025 (1983-11-01), Horvath
patent: 4530003 (1985-07-01), Blair et al.
patent: 4538168 (1985-08-01), Van Dyk Soerewyn
patent: 4603374 (1986-07-01), Wasielewski
patent: 4605058 (1986-08-01), Wilins
patent: 4771365 (1988-09-01), Cichocki et al.
patent: 4777560 (1988-10-01), Herrell et al.
patent: 4825337 (1989-04-01), Karpman
patent: 4833567 (1989-05-01), Saaski et al.
patent: 4833766 (1989-05-01), Herrell et al.
patent: 4888637 (1989-12-01), Sway-Tin et al.
patent: 5028984 (1991-07-01), Ameen et al.
patent: 5105259 (1992-04-01), McShane et al.
patent: 5128829 (1992-07-01), Loew
patent: 5172213 (1992-12-01), Zimmerman
patent: 5180001 (1993-01-01), Okada et al.
patent: 5213153 (1993-05-01), Itoh
patent: 5227663 (1993-07-01), Patil et al.
patent: 5253702 (1993-10-01), Davidson et al.
patent: 5289039 (1994-02-01), Ishida et al.
"High Performance Air Cooled Heat Sinks for Integrated Circuits" Claude Hilbert et al. IEEE Transactions on Components Hybrids, and Manufacturing Technology, vol. 13, No. 4, Dec. 1990.
Cunavelis er al., "External Module Heat Sink Fastened to Board" IBM Technical Disclosure Bulletin, vol. 14, No. 1, Jun. 1971, p. 182.
Almquist et al., "Spring-Clip Mounted Extruded Aluminum Heat Sink", IBM Technical Disclosure Bulletin, vol. 23, No. 12, May 1981, p. 5303.
"Low Profile Heat Sink", IBM Technical Disclosure Bulletin, vol. 28, No. 12, May 1986, pp. 5172-5173.
"Stick-On Heat Sink", Research Disclosure, No. 270, Oct. 1986, 27104.
Conners, P. M., "Variable Area Heat Sink Device" IBM Technical Disclosure Bulletin, vol. 17, No. 4, Sep. 1974, p. 1016.
Dimitroff, Michael, Magnesium Die Casting for Computer Enclosures, Computer Packaging Technology--Mar. 1994.
Nelson Daryl J.
Noble Scott L.
Gandhi Jayprakash N.
Intel Corporation
Picard Leo P.
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