Cold weld hermetic MEMS package and method of manufacture

Details Cold weld hermetic MEMS package and method of manufacture Cold weld hermetic MEMS package and method of manufacture

2005-05-27

2009-08-18

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

C438S106000, C257S704000

Reexamination Certificate

active

07576427

ABSTRACT:
A cold welded hermetic micro or nano package sealed in an inert atmosphere with optional force maintenance means for ensuring permanent closure. A package cap410coated with precursor weld material is sealed to a package base405containing integral device445then cold welded with an external force mechanism to compress and flow cold seal preform material435creating a hermetic peripheral seal in an inert or vacuum atmosphere. Arrays of devices can be sealed with individual caps or arrays of caps which are interconnected.

REFERENCES:
patent: 4145627 (1979-03-01), Ishizawa
patent: 6413800 (2002-07-01), Kyle
patent: 6429511 (2002-08-01), Ruby et al.

Affiliated with

Also associated with

Rating

Cold weld hermetic MEMS package and method of manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cold weld hermetic MEMS package and method of manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cold weld hermetic MEMS package and method of manufacture will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4059192