Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-01-29
2001-02-20
Picard, Leo P. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C361S697000, C361S699000, C361S703000, C165S104330, C174S016300, C257S722000
Reexamination Certificate
active
06191945
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to cooling of electronic components and more particularly to a cold plate arranged for simultaneously cooling a processor and its companion voltage regulator.
BACKGROUND OF THE INVENTION
Operation of high speed electronic components produces unwanted heat. For example, high speed computer processor elements such as microprocessors, graphics processors and the like generate unwanted heat that must be removed for efficient operation. Heat removal provides for a lower operating temperature, higher operating speeds and greater computing power. Additional advantages include higher reliability and availability.
To meet ever higher requirements for computing power, processor designs continue to evolve, becoming more complex and operating at ever higher speeds. More complex designs integrate greater and greater numbers of transistors, which each contribute to generation of more heat during operation. As each transistor is operated at higher speeds, heat generation is further increased.
Various cooling schemes are known in the prior art. In general, as cooling schemes become more efficient at removing heat, mechanisms to implement the schemes become larger, heavier, bulkier and more difficult to arrange in computer systems.
While high speed computer systems are blessed with tremendous computing power, they are also twice cursed: first they are cursed with the demanding cooling requirement of the high speed processors; and second they are cursed with even more demanding requirements for one or more specialized companion voltage regulators and high speed memories carefully arranged proximate to the high speed processors.
In some processor cooling schemes of the prior art, the bulky mechanisms for implementing the schemes interfere with advantageous arrangement and placement of the companion voltage regulator and memory for highest possible operating speed. For example, such bulky mechanisms have interfered when designers have pursued a substantially co-planar arrangement of the processor and voltage regulator extending across the surface of a motherboard. This problem is exacerbated by the introduction of additional bulky mechanisms for cooling the voltage regulator.
What is needed is an efficient and compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator, while still providing for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation.
SUMMARY OF THE INVENTION
The invention provides an efficient and compact cooling method and apparatus arranged for simultaneously drawing heat from both a processor and from the voltage regulator, while still providing for advantageous arrangement of the voltage regulator and memory proximate to the processor for high speed operation.
In the past, bulky cooling mechanisms have interfered when designers have pursued a substantially co-planar arrangement of the processor and voltage regulator extending across the surface of a motherboard. In contrast, the present invention provides a compact stack arrangement of voltage regulator, cold plate and processor, each advantageously arranged proximate to one another for high speed operation. The proximate arrangement also provides advantages in reduction of electrical noise (as well as corresponding reduction in requirements for use of decoupling components such as capacitors and the like.)
Briefly and in general terms the invention includes a processor requiring at least one bias voltage, and further includes a companion voltage regulator for providing the bias voltage. Electrical coupling between the voltage regulator and the processor conducts the bias voltages thereto. The voltage regulator is arranged sufficiently proximate to the processor, so as to limit inductance of the electrical coupling therebetween.
At least one cold plate is sandwiched between the processor and the voltage regulator in thermal communication therewith, and is arranged for simultaneously drawing heat from the processor and from the voltage regulator.
The invention further provides for electrical coupling between a memory and the processor, for conducting signals therebetween. The memory is arranged sufficiently proximate to the processor, so as to limit propagation delay of the signals through the electrical coupling, so as to provide for the high speed operation.
Other aspects and advantages of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.
REFERENCES:
patent: 4067237 (1978-01-01), Arcella
patent: 4120019 (1978-10-01), Arii et al.
patent: 4638854 (1987-01-01), Noren
patent: 4675783 (1987-06-01), Murase et al.
patent: 4829432 (1989-05-01), Hershberger et al.
patent: 4858093 (1989-08-01), Sturgeon
patent: 4938280 (1990-07-01), Clark
patent: 4951740 (1990-08-01), Peterson et al.
patent: 4975825 (1990-12-01), Huss et al.
patent: 5010292 (1991-04-01), Lyle, Jr.
patent: 5088005 (1992-02-01), Ciaccio
patent: 5118925 (1992-06-01), Mims et al.
patent: 5131859 (1992-07-01), Bowen et al.
patent: 5136119 (1992-08-01), Leyland
patent: 5144531 (1992-09-01), Go et al.
patent: 5162974 (1992-11-01), Currie
patent: 5311397 (1994-05-01), Harshberger et al.
patent: 5313099 (1994-05-01), Tata et al.
patent: 5339214 (1994-08-01), Nelson
patent: 5398822 (1995-03-01), McCarthy et al.
patent: 5461541 (1995-10-01), Wentland, Jr. et al.
patent: 5475606 (1995-12-01), Muyshondt et al.
patent: 5504650 (1996-04-01), Katsui et al.
patent: 5508908 (1996-04-01), Kazama et al.
patent: 5513070 (1996-04-01), Xie et al.
patent: 5522602 (1996-06-01), Kaplo et al.
patent: 5579827 (1996-12-01), Chung
patent: 5587920 (1996-12-01), Muyshondt et al.
patent: 5592391 (1997-01-01), Muyshondt et al.
patent: 5598320 (1997-01-01), Toedtman et al.
patent: 5621635 (1997-04-01), Takiar
patent: 5801924 (1998-09-01), Salmonson
Belady Christian L.
Cromwell S. Daniel
Datskovsky Michael
Hewlett--Packard Company
Lenell Jack A.
Picard Leo P.
LandOfFree
Cold plate arrangement for cooling processor and companion... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cold plate arrangement for cooling processor and companion..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cold plate arrangement for cooling processor and companion... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2596631