Cold curing epoxy resin formulations comprising amine-free antim

Details Cold curing epoxy resin formulations comprising amine-free antim Cold curing epoxy resin formulations comprising amine-free antim

1996-06-27

1998-03-24

Krass, Frederick

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523466, 528 92, 427137, C08G 5968, C08G 6510

Patent

active

057313695

ABSTRACT:
Cold curing epoxy resin compositions contain an epoxy functional component having an average epoxide functionality greater than 1; a hydroxy functional component; a pigment, a filler or a mixture thereof; and an SbF.sub.5 -alcohol complex curing agent in an amount effective to cure the epoxide composition. The cure rate of the compositions can be controlled by manipulating the pH and concentration of the filler and/or the pigment, making the use of amine rate controlling agents unnecessary. The compositions may be used, for example, as pavement marking compositions.

REFERENCES:
patent: 2952192 (1960-09-01), Nagin
patent: 3379653 (1968-04-01), Ernst et al.
patent: 3787349 (1974-01-01), Eliasson
patent: 4088633 (1978-05-01), Gurney
patent: 4255468 (1981-03-01), Olson
patent: 4503161 (1985-03-01), Korbel et al.
patent: 4503211 (1985-03-01), Robins
Chemical Abstracts, vol. 105, No. 20, 17 Nov. 1986, Abstract No. 173107; and Polym. Prepr., vol., 27, No. 2, 1986, pp. 165-166.
Encyclopedia of Polymer Science and Tehnology, vol. 6, pp. 322-382, 1986.

Affiliated with

Also associated with

Rating

Cold curing epoxy resin formulations comprising amine-free antim does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Cold curing epoxy resin formulations comprising amine-free antim, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cold curing epoxy resin formulations comprising amine-free antim will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2289475