Cold chassis for cooling electronic circuit components on an ele

Details Cold chassis for cooling electronic circuit components on an ele Cold chassis for cooling electronic circuit components on an ele

1989-01-03

1990-10-09

Thompson, Gregory D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

165 804, 357 82, 361385, 361389, 361415, 361429, H05K 720

Patent

active

049624440

ABSTRACT:
The problem of providing a compact high intensity cooling system for use with a cold chassis (42) for an electronic board (18) in a modular electronic system is solved by providing a frame (44) having a plurality of projecting ribs (46) defining grooves (48) for receiving edges of electronic boards. The ribs each include a plurality of impingement orifice plates (66a, 66b), spacer plates (68) and manifold plates (70a, 70b). The impingement orifice plates and the spacer plates cooperate to define first and second tortuous flow paths generally parallel to each other and perpendicularly to the plates for dual cooling fluid circuits. The manifold plates are disposed at opposite ends of the stack and define flow passages for distributing the cooling fluid to the tortuous flow paths. Inlets (78, 80) and outlets (90, 92) to and from the flow passages (72, 74) of the manifold plates are provided at a common edge of the stack of plates in communication directly through the frame to headers (50, 52, 54, 56) on the opposite side of the frame.

REFERENCES:
patent: 3631325 (1971-12-01), Wenz
patent: 4315300 (1982-02-01), Parmerlee et al.
patent: 4494171 (1985-01-01), Bland et al.
patent: 4520426 (1985-05-01), Wessely
patent: 4525770 (1985-06-01), Perretta
patent: 4550836 (1985-11-01), Ellis
Corderman, "Water Jacket Conduction Cooling", IBM Technical Disclosure Bulletin vol. 22, No. 1, Jun. 1979, pp. 206-207.

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