Coins coated with nickel, copper and nickel and process for maki

Details Coins coated with nickel, copper and nickel and process for maki Coins coated with nickel, copper and nickel and process for maki

1991-12-04

1992-09-29

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly single metal or alloy coating on...

72 46, 205149, 205181, 205217, 205222, 205227, C25D 512, C25D 518

Patent

active

051511673

ABSTRACT:
This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. The low current density may be about 1/6 to 1/4 of the full current density. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.

REFERENCES:
patent: 3594288 (1971-07-01), Reinert
patent: 3689380 (1972-09-01), Clauss
patent: 4089753 (1978-05-01), McMullen et al.
patent: 4189356 (1980-02-01), Merony
patent: 4247374 (1981-01-01), Ruscoe et al.
patent: 4279968 (1981-07-01), Ruscoe et al.
patent: 4418125 (1983-11-01), Henricks
patent: 4475991 (1984-10-01), Shabata
patent: 4666796 (1987-05-01), Levine
A. Kenneth Graham, Electroplating Engineering Handbook, second edition, Reinhold Publishing Corp., New York, 1962, pp. 670-671.
Frederick A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 194-202.

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