Coining method for bonding pad surface

Details Coining method for bonding pad surface Coining method for bonding pad surface

1994-05-16

1996-06-04

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

174 94R, 439 83, H01R 4316

Patent

active

055221335

ABSTRACT:
The punching face of a punch for coining is set smaller than the bonding pad surface of a lead frame to which wire bonding is applied and coining is applied to only a portion necessary for the wire bonding to be effected on the bonding pad surface.

REFERENCES:
patent: 5075941 (1991-12-01), Massironi
patent: 5270492 (1993-12-01), Fukui

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