Electrical connectors – Energy cell substitution device including plural contacts or...
Reexamination Certificate
2003-04-14
2004-01-13
Ta, Tho D. (Department: 2833)
Electrical connectors
Energy cell substitution device including plural contacts or...
C439S083000, C429S001000
Reexamination Certificate
active
06676440
ABSTRACT:
FILED OF THE INVENTION
The present invention relates to a coin type electric element such as a coin type battery and a printed circuit board with a coin type electric element, which is mounted by soldering thereon.
BACKGROUND OF THE INVENTION
A coin type electric element, such as a coin type battery and a coin type capacitor, has a pair of terminals in both ends. In such a coin type electric element, a sealing plate seals opening of the coin exterior case with a bottom, which encloses bottom side of the case. The sealing plate is fixed on the coin exterior case and held by an insulating seal interposed between them, and seals a coin exterior case alrtightly. The sealing plate is insulated from the coin exterior case by the insulating seal. The sealing plate and exterior case, which are insulated from each other, are used as a pair of electrodes. As shown in
FIG. 1
, in the coin type electric element of such a construction, the electrodes
105
, which are the exterior case
103
and the sealing plate
10
, are connected to a pair of leads
106
by spot welding. The ends of the two leads
106
are fixed on the conductive regions
109
of a printed circuit board
102
by soldering.
As shown in
FIG. 1
, the coin type electric element
101
mounted on the printed circuit board
102
by the two leads
106
by soldering. As shown in
FIG. 2
, soldering portions
106
B of the coin type electric element
101
makes the mount area on the printed circuit board
102
large. The reason is that the soldering portions
106
B of the leads
106
project outwardly from the coin type electric element
101
. Further, such a construction has a disadvantage that the mount area becomes larger when the soldering portions of the leads are enlarged in order to be fixed firmly.
Furthermore, in such a construction, when the leads are shortened in order to make the mount area small, the coin type electric element mounted on the printed circuit board tends to have a thermal influence caused by a heated soldering iron or melted solder. Especially, It is important to heat the lead to high temperature capable of sufficient melting solder in order to fix the lead firmly on the printed circuit board. The reason is that insufficient heating the lead causes a cold joint. Insufficient heating the lead deteriorates the flow of the melted solder, therefore the solder can not be in intimate contact with a large area of the surface of the lead. Accordingly, it is Important to heat the lead sufficiently to avoid a cold joint. The lead is heated by the soldering Iron thrust thereon. When solder becomes the temperature capable of sufficient melting of It by heating, the solder on a soldering Iron flows along the surface of the lead, and spreads in a large area. In order to diffuse solder widely, it is necessary to heat the lead sufficiently by a soldering iron. An operator thrusts soldering Irons to the lead and heats it until the solder flows widely on the surfaces of the leads. In the case that a coin type electric element sensitive to heat is soldered, leads should be heated carefully. If the temperature of the leads is too high, the coin type electric element has a thermal influence. While, If the temperature of the leads is too low, it causes a cold Joint. Especially, in a method of using a soldering iron, an operator adjusts heating by soldering irons with a visual check of a state of the solder. Therefore, it is very difficult to keep ideal soldering consistently.
Reflow soldering can perform temperature control exactly as compared with the method of using a soldering iron, However, since reflow soldering heats altogether by a hot air current, not only the lead but also the coin type electric element are heated. Therefore, as shown in
FIG. 1
, when the ends of the both leads are fixed on to the printed circuit board by reflow soldering, heating the whole of the coin type electric element to high temperature can damage the coin type electric element.
The present invention is devised to solve the above problems, and is aimed at providing a coin type electric element, which can be mounted on a small mount area and can be fixed firmly and with stability on a printed circuit board by soldering, and can prevent from a thermal influence, and a printed circuit board with a coin type electric element, which is mounted by soldering thereon.
SUMMARY OF THE INVENTION
A coin type electric element of the present invention have a coin exterior case formed of metal and in a coin shape with a bottom and an opening; a sealing plate, which is fixed on the opening of the coin exterior case, sealing airtightly the coin exterior case; and an insulating seal, which is interposed between the coin exterior case and the sealing plate, insulating the coin exterior case from the sealing plate. In the coin type electric element, one of the bottom of the coin exterior case and the sealing plate as a pair of terminals is a first terminal face. The other of the bottom of the coin exterior case and the sealing plate as the pair of the terminals is a second terminal face. A first soldering face to be fixed by reflow soldering is provided on the first terminal face. A second soldering face to be fixed by reflow soldering is provided on a tip portion of a lead connected to the second terminal face. The first soldering face and the second soldering face are positioned substantially in a same plane.
In this specification, “the first soldering face and the second soldering face are positioned substantially in a same plane” is defined such that the first soldering face and the second soldering face are positioned at positions capable of reflow soldering together.
The coin type electric element is a coin type battery or a capacitor. Further, in the coin type electric element, the tip portion of the lead is bent toward a surface side of the first terminal face, and an insulating film
8
is provided on a position, which opposes to the bent portion, in a surface of the bottom of the coin exterior case or a surface of the sealing plate. Furthermore, the first soldering face in the first terminal face is plated with a metal having an affinity for solder. In addition, the first soldering face is provided by fixing a metal film on the first terminal face.
A printed circuit board with a coin type electric element of the invention have the coin type electric element having a coin exterior case formed of metal and in a coin shape with a bottom and an opening, a sealing plate, which is fixed on the opening of the coin exterior case, sealing the coin exterior case airtightly, and an insulating seal, which is interposed between the coin exterior case and the sealing plate, insulating the coin exterior case from the sealing plate, and a printed circuit board with conductive regions provided thereon, on which the coin type electric element is mounted. In the printed circuit board, a first terminal face, which is one of the bottom of the coin exterior case and the sealing plate as a pair of terminals, is fixed on one of the conductive regions without a lead interposed between the first terminal and the one of the conductive regions by reflow soldering. A second terminal face, which is the other of the bottom of the coin exterior case and the sealing plate as the pair of the terminals, is fixed on the other conductive region by a lead soldered by reflow soldering.
In the printed circuit board with a coin type electric element, the sealing plate as the first terminal face is fixed directly on the one of the conductive regions by the soldering, and the bottom of the coin exterior case second terminal face is fixed on the other conductive region by a lead soldered by the soldering. In addition, the bottom of the coin exterior case as the first terminal face is fixed directly on the one of the conductive regions by the soldering, the sealing plate as the second terminal face is fixed on the other conductive region by a lead soldered by the soldering.
The lead is bent toward a position between the coin type electric element and the printed circuit board, and the bent por
Imanishi Masahiro
Inamine Shoichi
Kida Katsuyuki
Minamida Yoshitaka
Morita Seiji
Sanyo Electric Co,. Ltd.
Ta Tho D.
Wenderoth , Lind & Ponack, L.L.P.
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