Coin-shaped IC tag and method of manufacturing the same

Details Coin-shaped IC tag and method of manufacturing the same Coin-shaped IC tag and method of manufacturing the same

2005-03-29

2005-03-29

Flynn, Nathan J. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

C257S729000, C257S730000, C257S789000, C257S687000, C257S702000

Reexamination Certificate

active

06873033

ABSTRACT:
A coin-shaped IC tag which can be endowed with a predetermined weight is described. The coin-shaped IC tag ensures a normal operation and affords a satisfactory feeling of weightiness as a value medium. Methods of manufacturing the coin-shaped IC tag are also described. The coin-shaped IC tag comprises an IC tag core. The IC tag core comprises an IC packaging base member including a base and an electronic circuit for communicating data and for recording data, the electronic circuit mounted on the base. The IC tag core also comprises a high specific gravity resin layer joined to the IC packaging base member.

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Hideyo, “Non-Contact IC Card and Manufacture Thereof,” Patent Abstracts of Japan, vol. 1999, No. 04, Apr. 30, 1999, JP 11 001083, Jan. 6, 1999.

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