Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Reexamination Certificate
2001-06-20
2003-09-16
Flynn, Nathan J. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Smart card package
C257S687000, C257S702000, C257S729000, C257S730000, C257S787000, C257S788000, C257S789000, C257S790000, C257S795000
Reexamination Certificate
active
06621153
ABSTRACT:
BACKGROUND OF THE INVENTION
Technical Field to Which the Invention Belongs
This invention relates to an IC tag which can record data based on communications and transmit recorded data. More particularly, it relates to a coin-shaped IC tag which is usable as a medium (a substitute for money) for paying out, for example, gaming mobile objects such as “pachinko (Japanese upright pinball game)” balls or medals for use in the game of a pachinko machine or a slot machine in a gaming hall, and a method of manufacturing the coin-shaped IC tag.
Heretofore, there have been circular IC tags each of which records data and also updates and transmits recorded data. Since, however, the general structure of the IC tag is fabricated by covering an IC module with a synthetic resin material, it is light in weight.
In the ordinary use of the IC tag, this IC tag is held by appropriate holding means, and hence, no fault is caused in the operation of communications. However, in a case where the IC tag is used as a substitute for a coin (cash), namely, as a value medium, and where it is thrown in and rolled in use similar to the coin, it cannot be stably rolled on account of its light weight. This poses the problem that inferior operations occur in the transmission and reception of data.
Another problem is that, when the IC tag is used as the substitute for the coin (cash), the IC tag feels less valuable due to the light weight.
SUMMARY OF THE INVENTION
According to aspect of an embodiment of the invention a coin-shaped IC tag can be endowed with a predetermined weight, thereby ensuring a normal operation and affording a satisfactory feeling of weightiness as a value medium. The invention also includes a method of manufacturing the coin-shaped IC tag.
According to one embodiment of the invention, there is provided a coin-shaped IC tag comprising an IC packaging base member in which an electronic circuit for communicating data and for recording data is mounted on a base material; a high specific gravity resin material whose specific gravity is increased by mixing a material of high specific gravity into a resin material, and which is formed into a flat shape; an IC tag core which is formed by joining the high specific gravity resin material in the flat shape and the IC packaging base member; and a covering which is formed of a resin material at, at least, an outer peripheral edge of a surface of the IC tag core so as to present a coin shape.
In one aspect of the present invention, the base material of the IC packaging base member includes any of an ordinary substrate, a resinous substrate, a resinous film, and other base materials each of which can mount the electronic circuit including an antenna.
In a further aspect of the present invention, the flat shape of the high specific gravity resin material includes, not only a disc shape, but also any of the shape of a triangle, a tetragon, and a polygon having five or more sides.
In a further aspect of the present invention, the IC tag core can also be formed by joining the IC packaging base member onto one surface of the high specific gravity resin material in the flat shape.
In a further aspect of the present invention, it is also possible to form two members out of the high specific gravity resin material in the flat shape, and to form the IC tag core by interposing the IC packaging base member between the two members.
In a further aspect of the present invention, as the covering of the IC tag core, the outer peripheral edge can be covered with the resin material so as to present the coin shape (for example, a circular shape or an oval shape).
In a further aspect of the present invention, one surface of the IC tag core can be covered in addition to the above covering of the outer peripheral edge. Further, a literal graphic (for example, the amount of money, the name of a hall, or a logogram) can be formed of the covering resin material.
In a further aspect of the present invention, the resin material for covering the surface of the IC tag core so as to present the coin shape can be a colorable resin material so as to prevent the appearance of the design of the coin-shaped IC tag from being spoiled due to the color of the IC tag core.
In a further aspect of the present invention, the IC tag core is worked by heating under pressure, whereby the interfaces of the two members of the high specific gravity resin material are brought into contact and are bonded by fusion bonding. More specifically, in a case where the base material of the IC packaging base member is formed of a resinous film and where the IC tag core is worked by heating under pressure, the resinous film of the IC packaging base member is fused and removed from the interfaces. When the heating under pressure is further continued, the interfaces of the two members of the high specific gravity resin material can be brought into contact and can be bonded by fusion bonding.
In a further aspect of the present invention, the IC packaging base member and the high specific gravity resin material can be bonded by fusion bonding in such a way that ultrasonic waves are projected onto the IC tag core.
In a further aspect of the present invention, the IC packaging base member is formed by coating both surfaces of the resinous film with a binder and mounting the electronic circuit on both the surface of the resinous film, and the IC packaging base member is interposed between two molded compacts formed of the high specific gravity resin material in the flat shape, whereby the IC packaging base member and the two molded compacts can be bonded by the binder so as to form the IC tag core. That is, when the binder for mounting the electronic circuit on the resinous film being the base material is applied onto both the surfaces of the resinous film, it can be utilized also for bonding the high specific gravity resin material.
In a further aspect of the present invention, the IC packaging base members are formed by successively mounting and arraying the electronic circuits on a resinous film having a tape shape, and the respective pairs of molded compacts are opposed to each other in correspondence with the mounted and arrayed electronic circuits from above and below the resinous film and are heated under pressure, whereby the pairs of molded compacts and the corresponding IC packaging base members can be bonded so as to form the IC tag cores and also to separate the IC tag cores from the tape-shaped resinous film. That is, the IC tag cores are separated from the tape-shaped resinous base material simultaneously with the bonding working based on the heating under pressure, whereby working for the separation can be dispensed with.
In a further aspect of the present invention, the IC packaging base members of the tape-shaped resinous film are continuously conveyed, and the respective pairs of molded compacts are supplied during the conveyance, whereby the IC tag cores can be successively manufactured. That is, the IC tag cores can be mass-produced.
In a further aspect of the present invention, the coin-shaped IC tag according to this invention can be manufactured by injection molding in such a way that the IC tag core is inserted in a metal mold into which the covering resin material is poured.
In a further aspect of the present invention, the outer surface of each of the two molded compacts made of the high specific gravity resin material, except the interface thereof, is covered with the covering resin material by, for example, injection molding (dichroic molding), and the IC packaging base member is interposed between the two molded compacts, whereupon the molded compacts and the IC packaging base member can be bonded.
According to another embodiment of the invention there is provided a coin-shaped IC tag. The coin-shaped IC tag comprises: an IC packaging base member in which an electronic circuit for communicating data and for recording data is mounted on a base material; a high specific gravity resin material whose specific gravity is increased by mixing a material of high specific gravity into a resin mater
Iwamae Yoshiki
Kawai Wakahiro
Flynn Nathan J.
Foley & Lardner
Mandala Jr. Victor A.
Omron Corporation
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