Coil on a semiconductor substrate and method for its production

Details Coil on a semiconductor substrate and method for its production Coil on a semiconductor substrate and method for its production

2005-08-02

2005-08-02

Mai, Anh (Department: 2832)

Inductor devices

Windings

Having conductor of particular shape

C336S232000, C029S602100

Reexamination Certificate

active

06924725

ABSTRACT:
A coil apparatus includes a coil trace, a semiconductor substrate and a dielectric layer arranged on the semiconductor substrate, at least parts of the coil trace being arranged above a recess in the dielectric layer. The coil apparatus further includes a support apparatus arranged in the recess and connected to the coil trace for mechanically supporting the coil trace. The supporting apparatus is preferably a conductive column that is not removed when the recessed is formed in the dielectric layer.

REFERENCES:
patent: 5354599 (1994-10-01), McClanahan et al.
patent: 6174803 (2001-01-01), Harvey
patent: 6355535 (2002-03-01), Liou
patent: 6593224 (2003-07-01), Lin
patent: 6717269 (2004-04-01), Shroff et al.
patent: 6727174 (2004-04-01), Kotecki et al.

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