Coil integrated semi-conductor device and method of making the s

Details Coil integrated semi-conductor device and method of making the s Coil integrated semi-conductor device and method of making the s

1992-07-10

1994-06-07

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35CE, 174257, 174262, 257659, H05K 100

Patent

active

053191587

ABSTRACT:
A coil integrated semi-conductor device and method of making the same is disclosed. First to third metal layers are in sequence formed on a semi-conductor device. The first and third metal layers of equal width are connected to each other through contact holes, to define a hollow region which is filled with the second metal layer disposed centrally therein and a circumferential region surrounding the second metal layer. The first and third metal layers are used as a coil and the second metal layer is used as a core of magnetic material. The circumferential region surrounding the second metal layer is filled with different dielectric layers. According to the invention, a coil capable of exerting the magnetic field effect can be integrated in a semiconductor chip. This makes it possible contemplation of compactness, integration and preciseness of devices in the form that the coil is wound around the care. Therefore, the present invention is applicable to various systems in which the magnetic field caused by the current and the current induced by the magnetic field are utilized respectively. More particularly, the present invention is applicable to an oscillator, a small capacity motor, a magnetic field sensor and the like, as the form of the semi-conductor device.

REFERENCES:
patent: 4673904 (1987-06-01), Landis
patent: 5012125 (1991-04-01), Conway
Nguyen and Meyers,SI IC-Compatible inductors and LC Passive Filters, IEEE Journal of Solid State Circuits, vol. 25, No. 4, Aug. 1990.
Howe, et al., Silicon Micromechanics: Sensors and Actuators On A Chip, IEEE Spectrum, Jul. 1990.

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