Coil former with injection-molded encapsulation

Inductor devices – With outer casing or housing – Potted type

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Details

336 83, 336192, H01F 1510, H01F 2730

Patent

active

055700756

ABSTRACT:
A coil former with injection-molded encapsulation has a top fitting in which coil wire guides for guiding a coil wire are formed. By virtue of the specific shape and arrangement of the coil wire guides, it is ensured, in particular together with a special design of the housing which surrounds the coil former, that the coil wire is only stressed in its longitudinal direction. As a result, damage or preliminary damage of the coil wire is prevented and reliability is increased.

REFERENCES:
patent: 3328736 (1967-06-01), Keek
patent: 4890085 (1989-12-01), Saito
patent: 5132655 (1992-07-01), Suzuki et al.

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