Coil configurations for improved uniformity in inductively coupl

Details Coil configurations for improved uniformity in inductively coupl Coil configurations for improved uniformity in inductively coupl

1993-03-08

1995-03-28

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

156643, 118723I, 20429806, 20429834, H05H 100

Patent

active

054013500

ABSTRACT:
The present invention relates to an apparatus for generating a low pressure plasma circulating in a planar direction within a process enclosure. The invention generates plasma having substantially uniform density characteristics across a planar axis. The invention achieves improved uniformity of the plasma density by delivering more radio frequency power toward the periphery of the circulating plasma than toward the center of the plasma. Increasing the periphery power to the circulating plasma compensates for increased plasma losses due to interaction with the side walls of the process containment enclosure.

REFERENCES:
patent: 5226967 (1993-07-01), Chen et al.
patent: 5234529 (1993-08-01), Johnson
patent: 5241245 (1993-08-01), Barnes et al.

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