Coil component and method of manufacturing the same

Details Coil component and method of manufacturing the same Coil component and method of manufacturing the same

2006-03-21

2006-03-21

Mai, Anh (Department: 2832)

Inductor devices

Core forms casing

C336S200000, C336S233000, C029S602100

Reexamination Certificate

active

07015783

ABSTRACT:
A coil component includes a coil2having a through-hole1, a magnetic core encapsulating the coil, and a terminal4. The magnetic core includes a top portion11disposed at an upper part of the coil, a bottom portion12disposed at a lower part of the coil, and a middle portion13. An outer layer thickness of the middle portion (W1) is less than a diameter of the through-hole, while the top portion and the bottom portion are higher in density than the middle portion. The configuration of the present invention provides a small size coil component with less occurrence of magnetic saturation to prevent lowering of inductance even with thin top11and bottom portions11, 12. The coil component further has improved reliability.

REFERENCES:
patent: 4081776 (1978-03-01), Hisamoto et al.
patent: 4943793 (1990-07-01), Ngo et al.
patent: 5216402 (1993-06-01), Carosa
patent: 5359313 (1994-10-01), Watanabe et al.
patent: 6226148 (2001-05-01), Egawa et al.
patent: 6375884 (2002-04-01), Shikama et al.
patent: 6650218 (2003-11-01), Fushimi
patent: 6661328 (2003-12-01), Inoue et al.
patent: 199 01 255 (2000-07-01), None
Patent Abstracts of Japan, vol. 014, No. 234 (E-0929), May 17, 1990 & JP 02 062011 A (Matsushita Electric Ind. Co., Ltd.), Mar. 1, 1990—Abstract.

Affiliated with

Also associated with

Rating

Coil component and method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coil component and method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coil component and method of manufacturing the same will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3568582