Coil assembly

Inductor devices – Coil or coil turn supports or spacers – Printed circuit-type coil

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Details

336232, 336223, H01F 500, H01F 2728

Patent

active

059007974

ABSTRACT:
A coil assembly includes a first magnetic mother board, and a second magnetic mother board. A coil is formed on the first magnetic mother board and composed of stacked coil conductors and insulating layers. A recess or groove is formed in the second magnetic mother board and has a shape corresponding to the shape of the coil. The coil is closely fit into the recess so as to insure connection of the first and second magnetic mother boards. Direct connection of the first and second magnetic mother boards provides a completely closed magnetic path. The insulating layers have no magnetic materials so as to provide a better electromagnetic connection.

REFERENCES:
patent: 3898595 (1975-08-01), Launt
patent: 4547961 (1985-10-01), Bokil et al.
patent: 4959631 (1990-09-01), Hasegawa et al.
patent: 5430424 (1995-07-01), Sato et al.
patent: 5479695 (1996-01-01), Grader et al.
patent: 5515022 (1996-05-01), Tashiro et al.
patent: 5572180 (1996-11-01), Huang et al.
patent: 5578981 (1996-11-01), Tokuda
patent: 5583424 (1996-12-01), Sato et al.
patent: 5598135 (1997-01-01), Maeda et al.
patent: 5631822 (1997-05-01), Silberkleit et al.

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