Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-03-08
2005-03-08
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C250S503100, C250S518100, C250S518100, C250S518100, C250S518100
Reexamination Certificate
active
06864119
ABSTRACT:
A manufacturing method for a COF semiconductor device according to the present invention comprises:Step (A) of applying an insulating resin composition to a surface of an insulating tape on the surface of which a plurality of wiring patterns is arranged;Step (B) of pressably contacting a semiconductor element to the wiring patterns in the condition wherein the insulating resin composition is not yet cured; andStep (C) of fixing the semiconductor element to the wiring patterns so as to be electrically connected by curing the insulating resin composition, whereinthe manufacturing method for a COF semiconductor device further includes Step (D) of pre-heating the insulating tape from the rear surface side before, during, and/or after the application of the insulating resin composition.
REFERENCES:
patent: 6592783 (2003-07-01), Kumakura et al.
patent: 60-262430 (1985-12-01), None
patent: 63-151033 (1988-06-01), None
Nelms David
Nixon & Vanderhye P.C.
Tran Mai-Huong
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