Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2007-02-06
2007-02-06
Lee, Eddie C. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S713000, C257S703000, C257S791000, C257S792000, C257S778000, C257S737000, C257S706000, C257S668000, C361S749000
Reexamination Certificate
active
10386116
ABSTRACT:
The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF flexible printed wiring board contains an insulating layer, a wiring pattern, on which a semiconductor chip being mounted, formed of a conductor layer provided on at least one side of the insulating layer and a releasing layer, wherein the releasing layer is formed from a releasing agent containing at least one species selected from a silane compound and silica sol and is provided on a surface of the insulating layer, which is opposite to the mounting side of the semiconductor chip.
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Hayashi Katsuhiko
Sakata Ken
Im Junghwa
Lee Eddie C.
Mitsui Mining & Smelting Co. Ltd.
Sughrue & Mion, PLLC
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