Compositions – Electrically conductive or emissive compositions – Metal compound containing
Reexamination Certificate
2008-05-13
2011-12-20
Pyon, Harold (Department: 1761)
Compositions
Electrically conductive or emissive compositions
Metal compound containing
C222S129000, C252S500000
Reexamination Certificate
active
08080181
ABSTRACT:
Improved coextruded ribbons of material, such as can be used for making relatively fine conductive or ceramic lines or structures, having relatively high aspect ratios, are provided. The inks used to form the coextruded structures lack a yield stress and a high viscosity, but react at their interface to form a material having a finite yield stress or a high viscosity. This material then supports the shape of the extruded ink such that structures can be formed therefrom.
REFERENCES:
patent: 2007/0107773 (2007-05-01), Fork et al.
patent: 2007/0108229 (2007-05-01), Fork et al.
patent: 2007/0110836 (2007-05-01), Fork et al.
patent: 2007/0169806 (2007-07-01), Fork et al.
patent: 2008/0099952 (2008-05-01), Fork et al.
patent: 2008/0099953 (2008-05-01), Fork et al.
patent: 2008/0102558 (2008-05-01), Fork et al.
patent: 2008/0138456 (2008-06-01), Fork et al.
patent: 2009/0107546 (2009-04-01), Allison et al.
patent: 0 519 175 (1992-12-01), None
patent: 0519175 (1992-12-01), None
patent: 1 787 785 (2007-05-01), None
patent: 1 918 026 (2008-05-01), None
patent: WO 2007/018426 (2007-02-01), None
Van Hoy et al., “Microfabrication of Ceramics by Co-Extrusion”, Journal of the American Ceramic Society, vol. 81, No. 1, pp. 152-158 (1998).
U.S. Appl. No. 11/926,405, filed Oct. 29, 2007 to Allison et al.
U.S. Appl. No. 11/555,479, filed Nov. 1, 2006 to Fork et al.
U.S. Appl. No. 11/555,512, filed Nov. 1, 2006 to Fork et al.
U.S. Appl. No. 11/555,496, filed Nov. 1, 2006 to Fork et al.
U.S. Appl. No. 11/336,714, filed Jan. 1, 2006 to Fork et al.
U.S. Appl. No. 11/609,825, filed Dec. 12, 2006 to Fork et al.
Benner Frank
Fork David K.
Rao Ranjeet
Chiang Timothy
Oliff & Berridg,e PLC
Pyon Harold
SolarWorld Innovations GmbH
LandOfFree
Coextrusion ink chemistry for improved feature definition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coextrusion ink chemistry for improved feature definition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coextrusion ink chemistry for improved feature definition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4302447