Plastic and nonmetallic article shaping or treating: processes – Forming continuous or indefinite length work – Layered – stratified traversely of length – or multiphase...
Patent
1988-10-24
1990-11-13
Thurlow, Jeffery
Plastic and nonmetallic article shaping or treating: processes
Forming continuous or indefinite length work
Layered, stratified traversely of length, or multiphase...
2641761, 26433121, B29C 4706
Patent
active
049700413
ABSTRACT:
The present invention is directed to a, multilayered coextruded thermoplastic structure useful as a packaging material including a barrier layer of polyvinylidene chloride, a polycarbonate layer and an adhesive layer interposed therebetween. The polycarbonate resin of the invention is characterized by its low molecular weight. In a preferred embodiment the polycarbonate is further characterized by its special chain terminating agent.
REFERENCES:
patent: 3420729 (1969-01-01), Roberts
patent: 3524795 (1970-08-01), Peterson
patent: 3561629 (1971-02-01), Turner
patent: 3606958 (1971-09-01), Coffman
patent: 3707590 (1972-12-01), Wiggins et al.
patent: 3717544 (1973-02-01), Valyi
patent: 3869056 (1975-03-01), Valyi
patent: 3908070 (1975-09-01), Marzolf
patent: 4092391 (1978-05-01), Valyi
patent: 4107362 (1978-08-01), Valyi
patent: 4186154 (1980-01-01), Binsack et al.
patent: 4269964 (1981-05-01), Freitag et al.
patent: 4327137 (1982-04-01), Sawa et al.
patent: 4475241 (1984-10-01), Mueller et al.
patent: 4540623 (1985-09-01), Im et al.
patent: 4643937 (1987-02-01), Dickinson et al.
patent: 4659785 (1987-04-01), Nagano et al.
patent: 4798526 (1989-01-01), Briggs et al.
Macy Richard J.
Sarver Larry D.
Gil Joseph C.
Mobay Corporation
Preis Aron
Thurlow Jeffery
LandOfFree
Coextruded structures does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coextruded structures, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coextruded structures will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-775755