COB-typed LED package with phosphor

Details COB-typed LED package with phosphor COB-typed LED package with phosphor

2006-07-31

2008-09-23

Soward, Ida M (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Incoherent light emitter structure

With housing or contact structure

C257S081000, C257S082000, C257S100000, C257S433000, C257S434000, C257S680000

Reexamination Certificate

active

07427784

ABSTRACT:
A light emitting diode (LED) package unit, including a substrate having a concave, a LED chip, at least two electrodes, at least two wires, a gel and a first wavelength-converting material. The LED chip, disposed in the concave, including a top-face, a bottom-face for jointing with the substrate, and at least two chip-electrodes. The LED chip emits light of a first wavelength. The electrodes are disposed on the substrate. The wires are respectively connecting one of the chip-electrode with one of the electrode. The gel is disposed to seal the LED chip and the wires. The first wavelength-converting material including Sr—Si—O—N:Eu is doped within the gel. The first wavelength-converting material absorbs light of the first wavelength and emits light of a second wavelength longer than the first wavelength.

REFERENCES:
patent: 6953952 (2005-10-01), Asakawa
patent: 7045905 (2006-05-01), Nakashima
patent: 2005/0093146 (2005-05-01), Sakano
patent: 2006/0038477 (2006-02-01), Tamaki et al.
patent: 2007/0252513 (2007-11-01), Justel et al.

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