Coaxial wiring within SOI semiconductor, PCB to system for...

Details Coaxial wiring within SOI semiconductor, PCB to system for... Coaxial wiring within SOI semiconductor, PCB to system for...

2005-09-13

2005-09-13

Zarneke, David A. (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C174S251000

Reexamination Certificate

active

06943452

ABSTRACT:
An integrated circuit is provided that contains a coaxial signal line formed at least partially within a silicon-containing substrate. The coaxial signal line comprises an inner conductor having a length, said length axially surrounded by, and insulated from, an outer conductor along said length. A method of preparing such an integrated circuit having said coaxial signal line formed at least partially within a silicon-containing substrate is also disclosed herein.

REFERENCES:
patent: 3615760 (1971-10-01), Williams
patent: 5334962 (1994-08-01), Higgins et al.
patent: 5614439 (1997-03-01), Murooka et al.
patent: 5682062 (1997-10-01), Gaul
patent: 5811882 (1998-09-01), Latham, IV et al.
patent: 5814889 (1998-09-01), Gaul
patent: 6388198 (2002-05-01), Bertin et al.

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