Coaxial wiring pattern structure in a multilayered wiring board

Details Coaxial wiring pattern structure in a multilayered wiring board Coaxial wiring pattern structure in a multilayered wiring board

1992-02-21

1994-10-18

James, Andrew J.

Active solid-state devices (e.g., transistors, solid-state diode

Transmission line lead

257662, 330286, 330295, 331107C, H01L 2348, H01L 2940, H03F 360, H03B 512

Patent

active

053571380

ABSTRACT:
In a thick multilayered wiring board, a coaxial signal wiring pattern is surrounded by upper and lower horizontal grounded conductive layers and vertical grounded conductive layers and the vertical conductive layers of conductive layers which surround the coaxial signal wiring pattern are formed in a photosensitive dielectric layer by a photolithography, whereby matching of characteristic impedance of the pattern is improved and thus crosstalk is reduced.

REFERENCES:
patent: 4514749 (1985-04-01), Shoji
patent: 4626889 (1986-12-01), Yamamoto et al.
patent: 4958222 (1990-09-01), Takakura et al.
patent: 5111264 (1992-05-01), Hoshi
patent: 5126825 (1992-06-01), Harada

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