Coaxial vias in an electronic substrate

Details Coaxial vias in an electronic substrate Coaxial vias in an electronic substrate

1994-10-17

1996-07-30

Thomas, Laura

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

174264, 174265, 174262, 174260, H01F 500, H05K 116

Patent

active

055415679

ABSTRACT:
Structures are described having vias with more than one electrical conductor at least one of which is a solid conductor which is formed by inserting the wire into the via in a substrate wherein the wire is attached to an electrically conductive plate which is spaced apart from the substrate by a spacer which leave a space between the substrate and plate. The space is filled with a dielectric material. The space with via between the conductor and via sidewall is filled with a dielectric material. The via is used for making transformers and inductors wherein one of the via conductors is used for inner windings and another of the via conductors is used for outer windings.

REFERENCES:
patent: 3573707 (1971-04-01), Reynolds
patent: 3629939 (1971-12-01), Baer
patent: 3881244 (1975-05-01), Kendall
patent: 4383363 (1983-05-01), Hayakawa
patent: 4543553 (1985-09-01), Mandai et al.
patent: 4689594 (1987-08-01), Kawabata et al.
patent: 4694120 (1987-09-01), Accou
patent: 4706167 (1987-11-01), Sullivan
patent: 5126714 (1992-06-01), Johnson
patent: 5251108 (1993-10-01), Doshita
patent: 5279988 (1994-01-01), Saadat et al.
patent: 5282312 (1994-02-01), DiStefano et al.
patent: 5300911 (1994-04-01), Walters
patent: 5374788 (1994-12-01), Endon et al.

Affiliated with

Also associated with

Rating

Coaxial vias in an electronic substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coaxial vias in an electronic substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coaxial vias in an electronic substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1662526