Coaxial via structure for optimizing signal transmission in...

Details Coaxial via structure for optimizing signal transmission in... Coaxial via structure for optimizing signal transmission in...

2006-08-15

2006-08-15

Cuneo, Kamand (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S262000, C361S792000, C361S803000

Reexamination Certificate

active

07091424

ABSTRACT:
A coaxial via structure is adapted to transmit high speed signals or high intensity current through conductive layers of an electronic device carrier. The coaxial via structure comprises a central conductive track and an external conductive track separated by a dielectric material and is positioned in a core of the electronic device carrier or in the full thickness of the electronic device. The coaxial via structure can be combined with a stacked via structure so as allow efficient transmission of high speed signals across the electronic device carrier when a manufacturing process limits the creation of a full coaxial via structure across the entire electronic device carrier.

REFERENCES:
patent: 5689091 (1997-11-01), Hamzehdoost et al.
patent: 5949030 (1999-09-01), Fasano et al.
patent: 6479764 (2002-11-01), Frana et al.
patent: 6847274 (2005-01-01), Salmela et al.
patent: 2001/0040051 (2001-11-01), Lipponen

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