Coaxial semiconductor package

Electricity: conductors and insulators – Feedthrough or bushing – Compression

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

357 81, 357 82, 357 79, 174 15R, 361385, 361388, H01L 2346, H01L 2952

Patent

active

046149643

ABSTRACT:
A semiconductor package including a first electrically conductive bus and a second electrically conductive bus spaced from and generally surrounding the first bus in approximately concentric relation thereto. A plurality of generally equally angularly spaced semiconductors are located in the space between the buses and each semiconductor has at least two electrodes. One electrode of each semiconductor is connected to the first bus and the other electrode is connected to the second bus.

REFERENCES:
patent: 3025436 (1962-03-01), Staller
patent: 3146362 (1964-08-01), Bates et al.
patent: 3366171 (1968-01-01), Scharli
patent: 3474302 (1969-10-01), Blundell
patent: 3474306 (1969-10-01), Vogt
patent: 3474358 (1969-10-01), Geddry et al.
patent: 3566958 (1971-03-01), Zelina
patent: 3784885 (1974-01-01), Weidemann
patent: 3831062 (1974-08-01), Haug et al.
patent: 4128870 (1978-12-01), Knobloch et al.
patent: 4224663 (1980-09-01), Maiese et al.
patent: 4273185 (1981-06-01), Thoma et al.
patent: 4313128 (1982-01-01), Schlegel
patent: 4390891 (1983-06-01), Bahlinger
patent: 4403242 (1983-09-01), Tsuruoka
patent: 4528615 (1985-07-01), Perry

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Coaxial semiconductor package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coaxial semiconductor package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coaxial semiconductor package will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-987410

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.