Coaxial die and substrate bumps

Details Coaxial die and substrate bumps Coaxial die and substrate bumps

1992-03-24

1994-09-13

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174 35R, 174260, 2281801, A05K 100

Patent

active

053470869

ABSTRACT:
A coaxial bump for connecting a die to a substrate includes a center post and a ground ring surrounding and shielding the center post. The center post may be a center conductor line, and the ground ring may be generally torus-shaped, nearly closed or completely closed. The coaxial bump provides very low crosstalk in chip-to-substrate interconnections and provides a constant impedance with negligible inductive discontinuity.

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