Coax-to-microstrip transition

Details Coax-to-microstrip transition Coax-to-microstrip transition

1994-12-28

1996-09-03

Lee, Benny

Wave transmission lines and networks

Coupling networks

With impedance matching

333 34, 333246, H03H 738, H01P 500

Patent

active

055527531

ABSTRACT:
A coaxial-to-microstrip transition compensated to reduce the impedance discontinuity and parasitic inductance of the transition. The impedance discontinuity is reduced by decreasing the inductance due to the center conductor pin of the coaxial line and the inductance due to the bond wire connecting the center conductor pin to the microstrip line. The impedance discontinuity is also reduced by increasing the capacitance from the microstrip line to ground and from the microstrip line to the center conductor pin of the coaxial line. To reduce the inductance in the signal conduction path, a small diameter center conductor pin is used. A short length of bond wire, doubled around the center conductor is used to connect the center conductor pin to the microstrip line. Also, a thin dielectric substrate is used to minimize the length of the center conductor pin that extends beyond the base of the coaxial housing. The capacitance is increased by flaring the end of the microstrip line near the connection with the center conductor pin and partially extending the dielectric substrate over the opening in the coaxial line housing around the center conductor pin.

REFERENCES:
patent: 2794174 (1957-05-01), Arditi et al.
patent: 2983884 (1961-05-01), Rueger
patent: 3245013 (1966-04-01), Forge
patent: 3384842 (1968-05-01), Mattern et al.
patent: 4656441 (1987-04-01), Takahashi et al.
patent: 4837592 (1989-06-01), Gawronski et al.
patent: 4951011 (1990-08-01), Heckaman et al.
patent: 4994771 (1991-02-01), Takamine et al.
patent: 5418505 (1995-05-01), Agarwal et al.

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