Coatings for ceramic bonding capillaries

Details Coatings for ceramic bonding capillaries Coatings for ceramic bonding capillaries

1984-12-21

1987-09-08

Godici, Nicholas P.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228 447, 228 54, 219 5621, B23K 3700

Patent

active

046918540

ABSTRACT:
A bonding apparatus for bonding lead wires to a semiconductor surface includes a supply spool that contains a supply of the bonding wire that is fed to a capillary that is made of a non-conductive material. An electric arc forms a ball on the tip of the arc and the ball is retracted into the capillary. The ball is heated and compressed onto the semiconductor substrate and is then stitched over to a second bonding point which in most applications is the interface pin of the semiconductor device. The capillary has a non-conductive end that prevents coating of the capillary tip with the molten metal that results from the arcing of the bonding wire.

REFERENCES:
patent: 2501616 (1950-03-01), Robinson
patent: 3341660 (1972-02-01), Adams et al.
patent: 3358897 (1967-12-01), Christensen
patent: 3542277 (1970-11-01), Andrews
patent: 3863827 (1975-02-01), Foulke et al.
patent: 3973713 (1976-08-01), Furuya et al.
patent: 4327860 (1982-05-01), Kirshenboin et al.
patent: 4340166 (1983-07-01), Bilane et al.
patent: 4387283 (1983-06-01), Peterson et al.

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