Coating thickness monitor for multiple layers

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250273, G01N 2322

Patent

active

039846792

ABSTRACT:
An apparatus for measuring the plating thickness of a thin gold coating on a substrate such as a sheet or thin wire is described. The gold plating thickness, which may range from one to about one hundred and fifty microinches, is measured with an X-ray analysis technique in real-time as the plating of a wire is in process. The gold plated wire is exposed to X-rays of a type and intensity selected to stimulate X-ray emission from both the gold plating and the substrate with energies which permit energy-dispersive analysis. A ratio between the X-ray energies attributable to the substrate and gold plating is employed to determine the thickness of the gold plating with a generally applicable calibration curve. The accurate and rapid gold plating thickness measurement enables the monitoring the regulation of the gold plating thickness with a feedback control in a highly accurate manner.

REFERENCES:
patent: 2711480 (1955-06-01), Friedman
patent: 2897371 (1959-07-01), Hasler
patent: 3848125 (1974-11-01), Utt et al.

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