Compositions: coating or plastic – Coating or plastic compositions – Silicon containing other than solely as silicon dioxide or...
Reexamination Certificate
2006-12-26
2006-12-26
Brunsman, David M. (Department: 1755)
Compositions: coating or plastic
Coating or plastic compositions
Silicon containing other than solely as silicon dioxide or...
C438S780000, C438S790000
Reexamination Certificate
active
07153355
ABSTRACT:
To provide a silica film-forming material having a low dielectric constant and giving a film of less undergoing change in aging, a coating solution for forming a silica film includes a hydrolysis product of a mixture comprising: a tetraalkoxysilane; and at least one of a monoalkyltrialkoxysilane and a dialkyldialkoxysilane, and an ammonium salt represented by formula (I):wherein R1represents an alkyl group having from 6 to 30 carbon atoms, R2represents an alkyl group having from 1 to 5 carbon atoms, and X represents CH3COO, SO3H or OH.
REFERENCES:
patent: 6214104 (2001-04-01), Iida et al.
patent: 6471761 (2002-10-01), Fan et al.
patent: 6576568 (2003-06-01), Mandal et al.
patent: 6896955 (2005-05-01), Mandal et al.
patent: 2002/0020327 (2002-02-01), Hayashi et al.
patent: 2002/0042210 (2002-04-01), Mandal et al.
patent: 2002/0086166 (2002-07-01), Hendricks et al.
patent: 2006/0009575 (2006-01-01), Nakashima
patent: 6-263435 (1994-09-01), None
patent: 200226003 (2002-01-01), None
patent: 2004161875 (2004-06-01), None
Takamaro Kikkawa et al., Nikkei Microdevices, Feb. 2003 p. 123-132.
Taiwanese Office Action issued Jul. 27, 2006 (w/English Translation).
Sakamoto Yoshinori
Yamashita Naoki
Brunsman David M.
Tokyo Ohka Kogyo Co. Ltd.
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