Coating apparatus – Control means responsive to a randomly occurring sensed... – Responsive to attribute – absence or presence of work
Patent
1996-08-28
2000-10-31
Bareford, Katherine A.
Coating apparatus
Control means responsive to a randomly occurring sensed...
Responsive to attribute, absence or presence of work
118669, 118682, 118686, 118687, 118DIG2, 118410, B05C 300
Patent
active
061396397
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a coating method and coating apparatus for the application of coating liquids, particularly to a coating method and coating apparatus to produce stably a coating on a flat surface of a sheet substrate, which are suitable for application in electronic industrial areas such as semiconductor production. The invention also relates to a color filter manufacturing method based on said coating method, color filters thus manufactured, and a method for manufacturing coated sheet products such as color filters for liquid crystal displays and solid-state camera tubes, optical filters, printed circuit boards, integrated circuits and other semiconductor devices.
BACKGROUND ART
In recent years, the production of coatings through thin and uniform application of various coating liquids has been strongly demanded to form coatings over plastics substrates for optical filters, glass substrates for liquid crystal displays, and glass substrates for color filters, etc. and to form photoresists or protective layers on printed circuit boards or wafers, etc. in an integrated circuit or semiconductor manufacturing process. This requires the industrial-scale production of coatings on small-size substrates, in many cases less than 1 meter long in the coating direction, and necessitates the adoption of a sheet coating method which involves the feeding of substrates to the coater, one by one, application of coating liquids, and transfer of the coated substrates to the next process such as drying.
The methods which have been used conventionally and widely for such coating include the use of a spin coater, bar coater and roll coater.
Of these, the spin coater method which is widely used to form photoresist over a semiconductor wafer can apply coatings on a spinning substrate to be coated by dropping a droplet of coating liquid at the center of the substrate and spreading it over the surface by means of a centrifugal force. This method can produce uniform coatings over the entire surface of a substrate to be coated with a high thickness accuracy by choosing coating liquids suitable for this method. With the method, however, only several to ten percent of the coating liquid dropped on the surface of the substrate can be utilized for the actual formation of a coating, and the remainder, more than 90%, of that is removed from the surface and thrown away. Thus, a very large amount of coating liquid is required to obtain a film with a predetermined thickness, making the method uneconomical. In some cases, moreover, the coating liquid is deposited on an edge or the bottom surface of the substrate, or waste coating liquid scattered within the equipment gels or solidifies, which reduces stability and cleanliness, leading to degradation in the quality of the coated product.
The roll coater method involves the transfer of a coating liquid onto the surface of a substrate to be coated via a rubber roll, and is capable of applying a coating on a long material or on a continuous material wound onto a reel. However, since the coating liquid is supplied from a pan to an application roll and then to the substrate, exposure to the air becomes prolonged, which gives rise to vulnerability to degradation due to moisture absorption and oxidation, as well as the intrusion of foreign matter. As a result, degradation in the quality of the coated product tends to occur.
The bar coater method involves the application of a coating liquid onto a substrate to be coated using a bar made of a rod on which thin wire is wound. The problem with this method is that line marks are easily formed on the coating due to the contact between the wire wound on the rod and the coated substrate.
The die coater method, on the other hand, has been used conventionally and widely in areas where the production of thick coatings or continuous application of high-viscosity coating liquids is required. In case that a coating is formed on a substrate to be coated by using a die coater, the coating liquid is supplied through a slot of the di
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Abe Kazuhiko
Akamatsu Takayoshi
Goto Tetsuya
Ido Hideo
Kanamori Hiromitsu
Bareford Katherine A.
Toray Industries Inc.
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