Coating apparatus – Control means responsive to a randomly occurring sensed... – Responsive to attribute – absence or presence of work
Reexamination Certificate
2005-04-26
2005-04-26
Jolley, Kirsten (Department: 1762)
Coating apparatus
Control means responsive to a randomly occurring sensed...
Responsive to attribute, absence or presence of work
C118S052000, C118S301000, C118S320000, C118S321000, C118S323000, C118S504000, C427S240000, C427S425000, C438S758000, C438S782000
Reexamination Certificate
active
06884294
ABSTRACT:
A coating solution is sprayed on a rotating wafer held horizontally from a nozzle provided above the wafer while the nozzle is travelling over the wafer from a wafer center to a wafer outer area, thus spirally spraying the coating solution on the wafer. The nozzle stops when the coating solution has reached the wafer outer area and the coating solution is sprayed in circle on the wafer outer area while the wafer is rotating. A coating solution including a component of a coating film and a solvent may be sprayed on a first area to be coated of the wafer and the coating solution and a solvent for the coating film may be sprayed on a second edge area located outside the first area of the wafer.
REFERENCES:
patent: 5532192 (1996-07-01), Adams
patent: 5902399 (1999-05-01), Courtenay
patent: 5928425 (1999-07-01), Lee
patent: 6191053 (2001-02-01), Chun et al.
patent: 6371667 (2002-04-01), Kitano et al.
patent: 6383948 (2002-05-01), Kitano et al.
patent: 6407009 (2002-06-01), You et al.
patent: 6416583 (2002-07-01), Kitano et al.
patent: 20010039117 (2001-11-01), Ito et al.
Kitano Takahiro
Kurishima Hiroaki
Minami Tomohide
Ookura Jun
Sugimoto Shinichi
Jolley Kirsten
Tokyo Electron Limited
LandOfFree
Coating film forming method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coating film forming method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coating film forming method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3440990