Metal working – Barrier layer or semiconductor device making
Reexamination Certificate
2007-11-13
2007-11-13
Toledo, Fernando L. (Department: 2823)
Metal working
Barrier layer or semiconductor device making
Reexamination Certificate
active
10816894
ABSTRACT:
A coating apparatus coats a liquid material on a substrate in a coating chamber. A first liquid supply system that supplies the liquid material is provided in the coating chamber. A second liquid supply system is provided in the first liquid supply system that supplies a liquid that cleans or that deactivates the liquid material remaining in the coating chamber and/or in the first liquid supply system. A coating apparatus, a thin film forming method, a thin film forming apparatus, a semiconductor device manufacturing method, an electro-optic device, and an electronic instrument are provided that enable a high performance thin film with few defects and with a high degree of reproducibility to be obtained, that allow maintenance of the apparatus to be performed efficiently and safely, and that enable a thin film to be formed at low cost.
REFERENCES:
patent: 2004/0087068 (2004-05-01), Yudasaka
patent: A-60-58266 (1985-04-01), None
patent: A-64-59919 (1989-03-01), None
patent: A 3-81626 (1991-04-01), None
patent: A-4-171935 (1992-06-01), None
patent: A 5-154430 (1993-06-01), None
patent: A-5-226482 (1993-09-01), None
patent: A-8-32085 (1996-02-01), None
patent: A 8-83762 (1996-03-01), None
patent: A 9-10657 (1997-01-01), None
patent: A 9-213693 (1997-08-01), None
patent: A 11-262720 (1999-09-01), None
patent: WO97/43689 (1997-11-01), None
Oliff & Berridg,e PLC
Seiko Epson Corporation
Toledo Fernando L.
LandOfFree
Coating apparatus, thin film forming method, thin film... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coating apparatus, thin film forming method, thin film..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coating apparatus, thin film forming method, thin film... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3889376