Coating apparatus and method for applying a liquid to a semicond

Details Coating apparatus and method for applying a liquid to a semicond Coating apparatus and method for applying a liquid to a semicond

1990-09-20

1992-02-18

Beck, Shrive

Coating processes

Spraying

Heated coating material

427425, 118 52, 118600, 118302, 118321, B05D 130

Patent

active

050893050

ABSTRACT:
Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

REFERENCES:
patent: 691075 (1902-01-01), Riguad
patent: 3908592 (1975-09-01), Ordway et al.
patent: 4416213 (1983-11-01), Sakiya
patent: 4564280 (1986-01-01), Fukuda
patent: 4872417 (1989-10-01), Kunabara et al.
patent: 4886012 (1989-12-01), Ikeno et al.
patent: 4932353 (1990-06-01), Kawata et al.

Affiliated with

Also associated with

Rating

Coating apparatus and method for applying a liquid to a semicond does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Coating apparatus and method for applying a liquid to a semicond, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coating apparatus and method for applying a liquid to a semicond will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1822059