Coating apparatus and method for applying a liquid to a semicond

Details Coating apparatus and method for applying a liquid to a semicond Coating apparatus and method for applying a liquid to a semicond

1989-05-26

1991-03-26

Beck, Shrive

Coating apparatus

Projection or spray type

Plural projectors

118302, 118 52, 118321, B05C 500

Patent

active

050020080

ABSTRACT:
Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

REFERENCES:
patent: 691075 (1902-01-01), Rigaud
patent: 3908592 (1975-09-01), Ordmay et al.
patent: 4416213 (1983-11-01), Sakiya
patent: 4564280 (1986-01-01), Fuhuda
patent: 4872417 (1989-10-01), Kuwabara et al.

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