Coating apparatus

Details Coating apparatus Coating apparatus

1998-06-26

2000-04-25

Beck, Shrive

Coating apparatus

Projection or spray type

Rotating work

118 52, 427240, 427425, B05B 1304, B05C 1102

Patent

active

060539771

ABSTRACT:
A coating apparatus comprises a spin chuck for supporting a wafer rotatably, a driving mechanism for rotating the spin chuck, a nozzle for supplying a resist solution or a solvent to the wafer supported by the spin chuck, an outer cup arranged to surround the wafer supported by the spin chuck, an inner cup formed like a ring and arranged along an outer peripheral portion of the wafer to be coated over and in close vicinity of the outer peripheral portion upon coating, and an attaching and detaching mechanism for attaching and detaching the inner cup.

REFERENCES:
patent: 4838979 (1989-06-01), Nishida et al.
patent: 5578127 (1996-11-01), Kimura
patent: 5658615 (1997-08-01), Hasebe et al.
patent: 5861061 (1999-01-01), Hayes et al.
patent: 5879457 (1999-03-01), Sahoda et al.
patent: 5893004 (1999-04-01), Yamamura
Derwent Abstracts, AN 97-266875/24, JP 09-094516, Apr. 8, 1997, and Patent Abstracts of Japan, JP 09-094516, Apr. 8, 1997.
Patent Abstracts of Japan, JP 6-077121, Mar. 18, 1994, and Derwent Abstracts, AN 94-129877/16, JP 6-077121, Mar. 18, 1994.
Patent Abstracts of Japan, JP 6-13221, May 13, 1994, and Derwent Abstracts, AN 94-194859/24, JP 6-132211, May 13, 1994.
Patent Abstracts of Japan, JP 7-066107, Mar. 10, 1995, and Derwent Abstracts, AN 95-142559/19, JP 7-066107, Mar. 10, 1995.

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