Coating and developing apparatus

Details Coating and developing apparatus Coating and developing apparatus

2007-05-01

2007-05-01

Rutledge, D. (Department: 2851)

Photography

Fluid-treating apparatus

Fluid application to one side only of photographic medium

C355S027000, C414S935000

Reexamination Certificate

active

11028315

ABSTRACT:
A wafer flow recipe is prepared. Based on this wafer flow recipe, there are estimated and calculated respectively a PCD time from a time point at which a process for coating a resist liquid on a substrate by a coating unit has been terminated to a time point at which a first heating process is started at a first heating unit, a PAD time from a time point at which the first heating process has been terminated at the first heating unit to a time point at which an exposure process is started, and a PED time from a time point at which the exposure has been terminated to a time point at which a second heating process is started at a second heating unit. Then, these estimated times are displayed.

REFERENCES:
patent: 6507770 (2003-01-01), Tateyama et al.
patent: 2001-351848 (2001-12-01), None

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