Coating a heat curable liquid dielectric on a substrate

Details Coating a heat curable liquid dielectric on a substrate Coating a heat curable liquid dielectric on a substrate

1992-12-07

1994-03-29

Beck, Shrive

Coating processes

With post-treatment of coating or coating material

Heating or drying

427 96, 427420, 427314, B05D 302, B05D 512

Patent

active

052982882

ABSTRACT:
A porous substrate curtain coated with a single coating of a liquid dielectric that is cured into a well adhering film at least 15 microns thick with a uniformity of less than 5 microns. The substrate is cleaned to remove contaminants, heated to remove moisture, curtain coated with a single coating of a viscous heat curable liquid dielectric such as polyimide, and heated to cure the dielectric by increasing the temperature at most 15.degree. C. per minute to a predetermined cure temperature not exceeding 450.degree. C. The invention is well suited for fabricating a dielectric layer in a high density multichip module.

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