Metal fusion bonding – Process – Plural joints
Patent
1979-10-26
1982-07-20
Ramsey, Kenneth J.
Metal fusion bonding
Process
Plural joints
174 685, B23K 102, H05K 334
Patent
active
043401678
ABSTRACT:
Components can be held down on printed circuit boards by applying compositions comprising a water soluble polymeric compound or mixture of compounds which can be dissolved in water to give a greater than 45% solids content with a viscosity range of about 8 to about 12 poises at about 25.degree. C., a water soluble mono- or polyhydric alcohol, water, a wetting agent, and a water soluble organic acid having a keto oxygen group within 4 carbon atoms of the carboxylic acid group, to the printed circuit board prior to insertion of the components to keep them in place during soldering operations. The mixture can be completely removed after soldering by a water rinse.
REFERENCES:
patent: 3067159 (1962-12-01), Musser
patent: 3256247 (1966-06-01), Gagliardi et al.
patent: 3296208 (1967-01-01), Rogers
patent: 3296208 (1967-01-01), Rogers
patent: 3649597 (1972-03-01), Henley, Jr.
patent: 3954494 (1976-05-01), Stayner et al.
patent: 3966110 (1976-06-01), Boynton
patent: 3973322 (1976-08-01), Boynton
patent: 4113524 (1978-09-01), Katz
patent: 4143005 (1979-03-01), Packer
"Dantoin 684", Technical Bulletin A-101, published by GLYCO Chemicals, Inc., of Greenwich, Conn.
"Commercial Types of PVP", Information published by GLYCO Chemicals, Inc., pp. 3-4.
"Carbowax", (page 7 from Physical Properties Determined on commercial materials), GLYCO Chemicals, Inc.
Black Otis D.
Packer Marvin
Christoffersen H.
Morris Birgit E.
Ramsey Kenneth J.
RCA Corporation
Sites Edward J.
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