Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2001-12-20
2004-06-15
Tolin, G. (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C156S303100, C165S185000, C252S511000, C257S706000, C524S270000
Reexamination Certificate
active
06751099
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The invention relates to thermal heat spreaders, integrated circuit (“IC”) assemblies containing heat spreaders, and methods of making the heat spreaders and assemblies.
2. Related Art
An IC die may be mounted on a substrate to form an IC assembly. For example, a die may be mounted on a package substrate to form an IC package, or the die may be mounted directly to a printed circuit board (“PCB”). To dissipate heat from the die, a heat spreader is typically thermally coupled to the back of the die. Generally, there is a thermal interface material (“TIM”) between the die and the heat spreader. Poor adhesion between the TIM and the heat spreader is a common problem.
There is therefore a need to improve adhesion between the heat spreader and the TIM. There also is a need to improve such adhesion in a cost-effective manner.
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Deppisch Carl L.
Fitzgerald Thomas J.
Hansen Joni G.
Vrtis Joan K.
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Tolin G.
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