Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2005-02-15
2005-02-15
Niebling, John F. (Department: 2812)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
Reexamination Certificate
active
06855635
ABSTRACT:
Oxide particles with a doping component distributed in the core and a shell surrounding the core, which can be prepared by first introducing the doping into the core of a metal oxide or metalloid oxide via an aerosol in a pyrogenic process, subsequently coating the doped core with a salt solution of a metal or metalloid, drying it and optionally calcining it; which particles can be employed for chemical-mechanical polishing.
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Mangold Helmut
Schumacher Kai
Degussa - AG
Luk Olivia
Niebling John F.
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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