Coated bonding wires in high lead count packages

Details Coated bonding wires in high lead count packages Coated bonding wires in high lead count packages

1993-07-26

1995-10-03

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

361807, 361808, 174 524, 257690, H05K 502

Patent

active

054557453

ABSTRACT:
A transfer molded high lead count plastic semiconductor package is described. The packaged IC chip is mounted upon a suitable leadframe and the bonding pads wire bonded to the leadframe fingers. To avoid wire shorting, due to wire sweep during transfer molding, the wires are first coated with an insulative material.

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