Etching a substrate: processes – Masking of a substrate using material resistant to an etchant – Resist material applied in particulate form or spray
Patent
1998-03-12
2000-04-18
Gulakowski, Randy
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
Resist material applied in particulate form or spray
216 11, 216 24, 438 20, 438739, 438945, 445 51, H01J 904
Patent
active
060511494
ABSTRACT:
A process for forming an etch mask having a discontinuous regular pattern utilizes beads, each of which has a substantially unetchable core covered by a removable spacer coating. Beads which have a core and a spacer coating are dispensed as a hexagonally-packed monolayer onto a thermo-adhesive layer, which is on a target layer. The beads are kept in place by a bead confinement wall. Following a vibrational step which facilitates hexagonal packing of the beads, the resultant assembly is heated so that the beads adhere to the adhesive layer. Excess beads are then discarded. Spacer shell material is then removed from each of the beads, leaving core etch masks. The core-masked target layer is then plasma etched to form a column of target material directly beneath each core. The cores and any spacer material underneath the cores are removed. The resulting circular island of target material may be used as an etch mask during wet isotropic etching of an underlying layer. Such a combination of plasma etching using the bead cores as a primary mask and a wet etch using the islands formed by the plasma etch as a secondary mask may be used to form micropoint cathode emitter tips in an underlying conductive or semiconductive layer.
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Alanko Anita
Gulakowski Randy
Micro)n Technology, Inc.
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