Heat exchange – With retainer for removable article – Electrical component
Reexamination Certificate
1998-08-04
2001-01-16
Lazarus, Ira S. (Department: 3743)
Heat exchange
With retainer for removable article
Electrical component
C165S104330, C165S185000, C361S310000, C257S714000
Reexamination Certificate
active
06173760
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to an apparatus utilized in the fabrication of semiconductor devices. In particular, the invention relates to an apparatus utilized for removing heat from semiconductor chips during certain aspects of semiconductor device manufacture and testing.
BACKGROUND OF THE INVENTION
During manufacture of electronic devices individual semiconductor chips are typically attached to a substrate to create an electronic module. The electronic module substrate is temporally pressed, with relatively high force, into a socket for electrical testing and burn-in. The temperature of the chip must be accurately controlled even though it may dissipate large amounts of heat. Any thermal control means must apply only light force to the relatively fragile surface of the silicon chip. Additionally, the surface of the chip is not necessarily flat, parallel or of uniform height above the surface of the substrate that it is attached to.
SUMMARY OF THE INVENTION
The invention provides a device, a system that includes the device, and a method for temperature control of semiconductor devices. Along these lines, the present invention provides a system for controlling the temperature of an electronic component, the system includes a block for temporarily engaging a surface of the electronic component. The block includes channels for circulating a temperature regulating fluid to control the temperature of the block and thus, the attached electronic component.
Additional aspects of the present invention provide a block for temporarily engaging a surface of an electronic component for controlling the temperature of the component. The block includes a component engaging surface. A plurality of channels circulate a temperature regulating fluid to control the temperature of the block and the electronic component engaged by the block. At least one inlet port conducts the temperature regulating fluid into the channels. At least one outlet port conducts the temperature regulating fluid from the channels. A first manifold conducts the temperature regulating fluid to the channels from the at least one inlet port and from the channels to the at least one outlet port.
Further aspects of the present invention provide a method for controlling the temperature of electronic components. The method includes engaging a surface of an electronic component with a surface of a block for temporarily contacting and controlling the temperature of the electronic component. A temperature regulating fluid is supplied to the block through at least one inlet port and the block. The temperature regulating fluid is circulated through cooling channels in the block to control the temperature of the block and the attached electronic component. The temperature regulating fluid is withdrawn from the block through at least one outlet port in the block. During circulation of the temperature regulating fluid, testing and or manufacturing processes maybe carried out on the electronic component.
Still other objects and advantages of the present invention will become readily apparent by those skilled in the art from the following detailed description, wherein it is shown and described only the preferred embodiments of the invention, simply by way of illustration of the best mode contemplated of carrying out the invention. As will be realized, the invention is capable of other and different embodiments, and its several details are capable of modifications in various obvious respects, without departing from the invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
REFERENCES:
patent: 4561040 (1985-12-01), Eastman et al.
patent: 4686606 (1987-08-01), Yamada et al.
patent: 4729060 (1988-03-01), Yamamoto et al.
patent: 4740866 (1988-04-01), Kajiwara et al.
patent: 4759403 (1988-07-01), Flint et al.
patent: 4794981 (1989-01-01), Mizuno
patent: 4910642 (1990-03-01), Downing
patent: 4920574 (1990-04-01), Yamamoto et al.
patent: 4951740 (1990-08-01), Peterson et al.
patent: 4977444 (1990-12-01), Nakajima et al.
patent: 5029638 (1991-07-01), Valenzuela
patent: 5070936 (1991-12-01), Carroll et al.
patent: 5145001 (1992-09-01), Valenzuela
patent: 5294830 (1994-03-01), Young et al.
patent: 5537291 (1996-07-01), Onodera et al.
Gardell David L.
Gaspar Krisztian
Morin Guy C.
International Business Machines - Corporation
Lazarus Ira S.
McKinnon Terrell
Pollock, Vande Sande & Amernick, R.L.L.P.
LandOfFree
Co-axial bellows liquid heatsink for high power module test does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Co-axial bellows liquid heatsink for high power module test, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Co-axial bellows liquid heatsink for high power module test will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2532451