CMP wafer carrier for preferential polishing of a wafer

Details CMP wafer carrier for preferential polishing of a wafer CMP wafer carrier for preferential polishing of a wafer

1997-04-23

1999-03-23

Scherbel, David A.

Abrading

Abrading process

Glass or stone abrading

451384, 451387, B24B 100

Patent

active

058851356

ABSTRACT:
An apparatus for polishing a semiconductor wafer is provided which includes a wafer carrier having on its lower surface a non-uniform surface structure means to vary the force against a wafer during a polishing operation so that the polishing is enhanced and imparts a planar surface across the polished wafer. Preferred non-uniform surface structure means include use of a wafer carrier having on its lower surface a backing film having a first central portion having a predetermined compressibility and a second peripheral portion having a different compressibility than the first portion. Another non-uniform surface structure means to vary the force against the wafer comprises a wafer carrier having on its lower surface a raised circumferential region around the periphery of the carrier.

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