CMP slurry measurement and control technique

Details CMP slurry measurement and control technique CMP slurry measurement and control technique

1996-08-23

1998-12-08

Tung, T.

Electrolysis: processes, compositions used therein, and methods

Electrolytic analysis or testing

For corrosion

156345LC, 156345LP, 1566271, 1566361, 1566371, 1566451, 204400, 204412, 204434, 2057895, 2057905, 2057945, 216 86, 216 89, 216 90, G01N 2726, H01L 2166

Patent

active

058463984

ABSTRACT:
Chemical mechanical polishing slurry characteristics, such as oxidant concentration and abrasive particle dispersion, are determined using electrochemical measurement techniques, such as chronoamperometry, amperometry, chronopotentiometry, ionic conductivity, or linear sweep potentiometry. Slurry characteristics may be tested and monitored independent of a CMP polishing tool. Slurry characteristics may also be automatically controlled in an on-line chemical mechanical polishing process using electrochemical measurements.

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