CMP polishing pad having grooves arranged to improve...

Details CMP polishing pad having grooves arranged to improve... CMP polishing pad having grooves arranged to improve...

2006-06-13

2006-06-13

Nguyen, Dung Van (Department: 3723)

Abrading

Flexible-member tool, per se

Interrupted or composite work face

C451S530000

Reexamination Certificate

active

07059950

ABSTRACT:
A polishing pad (104, 304, 404, 504) having an annular polishing track (152, 312, 412, 512) for polishing a wafer (120, 316, 416, 516). A plurality of grooves (112, 320, 420, 520) are arranged within the wafer track so that they are spaced from one another both radially and circumferentially relative to the rotational nature of pad and are at least partially non-circumferential relative to the pad.

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patent: 2002/0083577 (2002-07-01), Suzuki
patent: 1 114 697 (2001-07-01), None

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